The book describes 3D optical interconnects intended for high-performance chip and board-level communications.
In the first three chapters, it presents the fundamentals and challenges of optical interconnection and the strategies for scaling at the chip and module level. It then covers, in three chapters, the fundamentals of heterogeneous integrated photonics technologies pioneered by the author's research. The final three chapters, in a hundred pages, treat self-organized lightwave networks—or SOLNET—and develop in detail the technologies for fabrication of the interconnect along with modeling, computer simulation of the performances and experimental validation.
The book is stimulating for a variety of readers—scientists, engineers and students—and will be a useful reference for further research and development in the nascent field of optical interconnections.
Review by Silvano Donati, University of Pavia, Italy.
The opinions expressed in the book review section are those of the reviewer and do not necessarily reflect those of OPN or OSA.