S. M. Bedair
Integrated optical and electronic devices require the fabrication of many different components, each with its own material and structural requirements, on one chip. To achieve optimum performance of an integrated device, each individual device structure should fulfill its optimum material, thickness, and doping requirements. Current activities in device integration have relied mainly on the same multilayer structure to fabricate the different optical and electronic components. Thus, a single or multilayer structure that is optimum for one particular device—for example, a field-effect transistor (FET)— might not satisfy the device structure required for a detector or laser.
This article is only available as a PDF.
Publish Date: 01 June 1992
Log in or Become a member to view the full text of this article.
This article may be available for purchase via the search at Optica Publishing Group.
Optica Members get the full text of Optics & Photonics News, plus a variety of other member benefits.
Laser Metal Deposition for High-Density Interconnect
Laser Chemical Etching of Semiconductors
Materials Patterning with Excimer Laser Ablation
Applications of Pulsed Laser Deposition to Optics
Laser Cleaning Techniques for Critical Surfaces
Image Technology in Engineering Practice: An Example from Optical Testing.
Good Reason for Microscope Users to Take Part in Standard Setting
Scintillate, Scintillate Little Star...
Computer-Generated Phase-Only Holograms for 3D Displays: A MATLAB Approach
Lighting a Better Path to 3D-Printed Hydrogels
Reconfigurable Metasurfaces Control Light Precisely