Packaging Considerations for Optoelectronics Devices

Over the next decade, the design of optoelectronics packaging will require significant changes to be cost-effective and easily manufactured. Benzoni, Anigbo, and Dudley discuss the challenges involved in achieving these changes and offer some guidelines for creating inexpensive, robust packaging.

Access to the full text of this article is restricted. In order to view this article please log in.


Add a Comment

comments powered by Disqus