H. Thienpont, A. Kirk, A. Goulet, V. Baukens, K. Praet, N. Nieuborg, M. Kuijk, R. Vounckx, and I. Veretennicoff, Vrije Universiteit Brussel, Brussels, Belgium, and P. Heremans and S. Borghs, IMEC, Leuven, Belgium
For several years there has been a realization that electronics is facing limits in both the speed and parallelism that may be achieved with conventional wiring. This is particularly apparent for chip-to-chip and board-to-board interconnects. Optics has been widely studied as a suitable high-speed interconnection medium to overcome this interconnection bottleneck. It is attractive due to its better immunity to capacitative and inductive crosstalk, signal dispersion, and electromagnetic interference.
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