C.J. Chang-Hasnain, Y.A. Wu and R. Nabiev
Vertical cavity surface emitting lasers (VCSEL) are promising for optical interconnects, communications, and signal processing. The most promising aspect lies in the prospect of eliminating low yield and high cost laser fabrication steps such as wafer lapping, cleaving, dicing, and facet coatings. Moreover, the topology of a vertical cavity facilitates on-wafer testing, pre-process screening, and the fabrication of large 2D arrays.
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