Laser Metal Deposition for High-Density Interconnect
Y. S. Liu
Fabrication of interconnect structures using lasers has become in creasingly important as demands for discretionary interconnects grow. Patterned deposition of metals and dielectrics are key technologies of interconnect fabrication for microelectronic and optoelectronic applications. Lasers offer the flexibility of in-situ process monitoring, tuning, and control, and the capability of interfacing with CAD tools to allow on-the-fly design changes and testing.
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