Integrated Enhanced Epitaxy of Optoelectronic Materials
Integrated optical and electronic devices require the fabrication of many different components, each with its own material and structural requirements, on one chip. To achieve optimum performance of an integrated device, each individual device structure should fulfill its optimum material, thickness, and doping requirements. Current activities in device integration have relied mainly on the same multilayer structure to fabricate the different optical and electronic components. Thus, a single or multilayer structure that is optimum for one particular device—for example, a field-effect transistor (FET)— might not satisfy the device structure required for a detector or laser.
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