R. A. Elliot, J. Puretz, R. K. DeFreez, J. Orloff, and L. W. Swanson
During the past few years, there has been considerable interest in monolithic integration of optical and electronic elements on semiconductor wafers to enable fabrication of optical computers and the next generation of broadband communication systems. The successful implementation of integrated optoelectronics demands the ability to form optical-quality microsurfaces to serve as mirrors or coupling elements.
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