Mirror-Forming Technology for Integrated Diode Lasers

Z. L. Liau and J. N. Walpole

Nearly all semiconductor lasers developed to date have mirrors formed by cleaving, i.e., by breaking the substrate along certain crystallographic planes. Although the cleaving procedure is relatively simple and is capable of yielding high quality mirrors, it does constrain the chip size to typically 300 microns, the laser-cavity length.

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